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Emulsion Protection Film
i) (For Liquid Solder Resist)
PA8X can be easily removed from the surface of the phototools and is repeelable without any remnants of adhesive. PA8X is a standard type for the Liquid Solder Photo Resist Series.
ii) (For Liquid Solder Resist)
A matted surface improves adhesion and vacuum pressure.
iii) (For Dry Film Photo Resist & Fine Pattern)
4 Mm thick adhesive layer improves adhesion to the emulsion surface of film and glass.
iv) (For Liquid Solder Resist)
HAIOK can be easily removed from the surface of the phototools and is repeelable without any remnants of adhesive. Compared with standard type of KIMOTECT, "HA-10K" improves on its non-stick performance to liquid resist ink, and so it is especially suited for mass production.
v) (For Fine Pattern)
The antistatic treatment frees PA12 from the sticking of dirt and dust. It is repeelable without any remnants of adhesive. 6 mm thick adhesive layer improves adhesion to the emulsion surface of film and glass.
vi) (For Fine Pattern)
PA12X can be easily removed from the surface of the phototools and is repeelable without any remnants of adhesive. 6 mm thick adhesive layer improves adhesion to the emulsion surface of film and glass.

kimoto, Liquid Solder Resist, filmguard, Artwork Protection Film, kimotect, fine pattern
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